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Overview

Participants will have the foundational knowledge to apply for entry-level engineering and technician positions in the semiconductor packaging industry following the completion of the program.

For additional information please visit https://vast-alliance.org.

Agenda/Schedule

The packaging certificate program will be 10 weeks and will include 20 sessions of online lectures, and 10 sessions of hands-on, in person lab training. The course consists of 5 modules.

  • Packaging components, materials, and processes
  • Electrical design
  • Thermal design
  • Reliability
  • Lab equipment operations, maintenance and repair

Each module will emphasize the trade-offs associated with different packaging technologies, based on electrical, thermal, and physical performance requirements, and will be accompanied by related virtual laboratory demonstrations.

 

Lab Option

Location option 1: Virginia Tech Research Center in Arlington, Virginia.

Lab Option 1: Thursdays 8am-12 pm

Lab Option 2: Thursdays 3pm-7pm

If these lab hours are not feasible for your schedule, please contact us at info@vast-alliance.org, suggesting a schedule that may work better for you.

 

Lectures are asynchronous, requiring completion of specific modules every week.

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Section Title
VAST Semiconductor Packaging and Characterization Certificate
Type
Discussion
Dates
Feb 09, 2026 to May 01, 2026
Contact Hours
40.0
Fee(s)
Fees starting at $2,000.00
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