100768 - CPES Short Course Series
Overview
Power Electronics Packaging - June 23-27, 2025 (100768-567884)
Power electronics packaging is advancing to meet rising demand in sectors like consumer electronics, electric transportation, data centers, and renewable energy. This course covers fundamental packaging concepts, cross-disciplinary principles, and finite element analysis (FEA) simulation.
Participants will learn theory and the latest research on electrical, thermal, materials, and reliability challenges, gaining insights into trade-offs and cutting-edge solutions. Topics covered include: die attach, interconnects, electrical and thermal characterization, encapsulation and high-voltage characterization, and thermal and power cycling.
Engineers will be prepared to design effective packages for modern power electronics systems through hands-on experiments conducted in CPES’ world-class Packaging Laboratory. Participants will use ANSYS Electronics Desktop as well as the following instruments:
- Wire Bonder, Die Bond Tester (Shear and Pull), Vacuum Oven, Curve Tracer, and Thermal Analyzer
Model and Control for DC/DC Converters - July 28-31, 2025 (100768-567885)
This course includes DC/DC converter analysis, modeling, simulation, control design and frequency domain measurement techniques. Participants will receive hands-on guidance in the lab to solve design challenges using control methods for Buck and Boost converters, including peak current-mode and voltage-mode control. They will explore the impact of loop-gain design on performance metrics and gain a solid understanding of power converter control through dc and ac characteristic analysis through the following topics:
DC and steady-state analysis of PWM converters - forward and flyback converters, DC characteristics, PWM controller operation
Modeling and analysis of PWM converters - average modeling of PWM converters, small-signal modeling of PWM converters, open-loop small-signal and transient characteristics
Single-loop control for PWM converters - loop-gain, phase and gain margins, design of single-loop compensators, closed-loop, small signal and transient characteristics
Advanced current-mode control - peak current-mode control using standardized control modules (SCM), average current-mode control, charge control, constant on-time V2 control
Registration closes after July 21, 2025 or when course reaches its maximum capacity.
Electromagnetic Interference - August 4-7, 2025 (100768-567886)
Electronics and electrical devices, permeating into every corner of our lives, operate at faster speeds with smaller sizes. This trend makes electromagnetic interference (EMI) a much more pervasive issue and much more challenging for practically every engineer in the electrical and computing engineering field.
While EMI and solutions tended to be viewed by many as “dark magic,” through this four-day course, participants will learn:
Fundamental theory of EMI/EMC, to understand how EMI noises originate and couple into victim circuits
EMI measurement, regulations, and standards
Models of practical circuit components, and parasitic components in circuits and the important roles they play in EMI
EMI/EMC mitigation solutions, such as balancing, grounding, shielding, and filtering, and best engineering practices to mitigate EMI issues in designs
Examples of some of the recent academic and industrial research on EMI.
The course emphasizes practical solutions and trade-offs, integrating theoretical concepts with hands-on learning for effective EMI management in designs.